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Found: 625      Displaying: 601 - 620
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
601.
UT22VP10C-25PCARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
602.
UT22VP10C-25PCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
603.
UT22VP10C-25PCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
604.
UT22VP10E-25PCARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
605.
UT22VP10E-25PCCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
606.
UT22VP10E-25PCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
607.
UT22VP10E-25PCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
608.
UT22VP10E-25PPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
609.
UT22VP10E-25PPARadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
610.
UT22VP10E-25PPCRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
611.
UT22VP10E-25PPXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
612.
UT22VP10E-25PPXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
613.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
614.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
615.
UT22VP10T-25PCCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
616.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
617.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
618.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
619.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
620.
UT22VP10T-25PPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
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