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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 161. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 162. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 163. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 164. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 165. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 166. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 167. | UT22VP10E-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 168. | UT22VP10E-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 169. | UT22VP10E-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 170. | UT22VP10E-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 171. | UT22VP10E-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 172. | UT22VP10T-20WCA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 173. | UT22VP10T-20WCX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 174. | UT22VP10T-20WPA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 175. | UT22VP10T-20WPA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 176. | UT22VP10T-20WPC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 177. | UT22VP10T-20WPC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 178. | UT22VP10T-20WPX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
