We have more Special DataSheet than other site. If, There is not a datasheet which searches, Request ! (It will updated in 12 hours.)
GetDatasheet.com is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.
All Data provided on this web site and the associated web pages is provided as is. It is intended to be for general information only, and is thus provided without any express or implied warranty or guarantee. It is the responsibility of the user or reader to ensure and confirm that this information is accurate and correct with the original publisher of the data sheet.
Most of the data sheets below are in the "pdf" format so it would be adviseable to use Adobe Acrobat Reader.
| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1721. | UT22VP10C-20PCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1722. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1723. | UT22VP10E-20PCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1724. | UT22VP10E-20PCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1725. | UT22VP10T-20PCA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1726. | UT22VP10T-20PCA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1727. | UT22VP10T-20PCC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1728. | UT22VP10T-20PCX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 1729. | UT22VP10T-20PPA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 1730. | UT22VP10T-20PPC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 1731. | UT22VP10T-20PPX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 1732. | UT54ACS20PCA | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1733. | UT54ACS20PCA | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1734. | UT54ACS20PCC | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish gold. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1735. | UT54ACS20PCX | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish optional. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1736. | UT54ACS220PCA | RadHard MSI. Clock and wait-state. CMOS compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1737. | UT54ACS220PCA | RadHard MSI. Clock and wait-state. CMOS compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1738. | UT54ACS220PCC | RadHard MSI. Clock and wait-state. CMOS compatible I/O level. Lead finish gold. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1739. | UT54ACTS20PCA | RadHard MSI. Dual 4-input NAND. TTL compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
| 1740. | UT54ACTS220PCA | RadHard MSI. Clock and wait-state. TTL compatible I/O level. Lead finish solder. | UTMC | Ceramic DIP | 14 | -55°C | 125°C | 15K |
