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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 261. | AM26LS31CDBR | Quadruple differential line driver | TI | SSOP | 16 | 0°C | 70°C | 153K |
| 262. | AM26LS31CDR | Quadruple differential line driver | TI | SOIC | 16 | 0°C | 70°C | 153K |
| 263. | G901CD-AC110-12 | Relay. Coil voltage 110 VAC. Mounting PCB w / Top QC. Contact form C. Covering dust cover. Spacing UL873. Insulation class F. | GCC | - | - | -55°C | 85°C | 133K |
| 264. | G901CD-AC220-12 | Relay. Coil voltage 220 VAC. Mounting PCB w / Top QC. Contact form C. Covering dust cover. Spacing UL873. Insulation class F. | GCC | - | - | -55°C | 85°C | 133K |
| 265. | G901CD-AC24-12 | Relay. Coil voltage 24 VAC. Mounting PCB w / Top QC. Contact form C. Covering dust cover. Spacing UL873. Insulation class F. | GCC | - | - | -55°C | 85°C | 133K |
| 266. | G901CD-AC24-12 | Relay. Coil voltage 24 VAC. Mounting PCB w / Top QC. Contact form C. Covering dust cover. Spacing UL873. Insulation class F. | GCC | - | - | -55°C | 85°C | 133K |
| 267. | G901CD-AC48-12 | Relay. Coil voltage 48 VAC. Mounting PCB w / Top QC. Contact form C. Covering dust cover. Spacing UL873. Insulation class F. | GCC | - | - | -55°C | 85°C | 133K |
| 268. | MC68HC705KJ1CDW | HCMOS microcontroller unit, 64 bytes RAM, 1240 bytes ROM, 4 MHz | MOT | SOIC | 16 | -40°C | 85°C | 1M |
| 269. | MC68HLC705KJ1CDW | HCMOS microcontroller unit, 64 bytes RAM, 1240 bytes ROM, 4 MHz | MOT | SOIC | 16 | -40°C | 85°C | 1M |
| 270. | MC68HRC705KJ1CDW | HCMOS microcontroller unit, 64 bytes RAM, 1240 bytes ROM, 4 MHz | MOT | SOIC | 16 | -40°C | 85°C | 1M |
| 271. | THS4601CDDA | Wideband, FET-input operational amplifier | TI | SOIC | 8 | 0°C | 70°C | 381K |
| 272. | TL501CDW | Analog-to-digital-converter building blocks | TI | SO | 20 | 0°C | 70°C | 787K |
| 273. | TSH71CDT | WIDE BAND, LOW POWER OPERATIONAL AMPLIFIER | STM | - | - | - | - | 1M |
| 274. | TSM1051CDT | CONSTANT VOLTAGE AND CONSTANT CURRENT CONTROLLER FOR BATTERY CHARGERS AND ADAPTORS | STM | - | - | - | - | 108K |
| 275. | UT69151CDXEGCA | Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. +5V operation. Lead finish solder. | UTMC | PGA | 96 | -55°C | 125°C | 47K |
| 276. | UT69151CDXEGCC | Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. +5V operation. Lead finish gold. | UTMC | PGA | 96 | -55°C | 125°C | 47K |
| 277. | UT69151CDXEGCX | Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. +5V operation. Lead finish optional. | UTMC | PGA | 96 | -55°C | 125°C | 47K |
| 278. | UT69151CDXEGPC | Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. +5V operation. Lead finish gold. Prototype. | UTMC | PGA | 96 | - | - | 47K |
| 279. | UT69151CDXEWCA | Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. +5V operation. Lead finish solder. | UTMC | FlatPack | 100 | -55°C | 125°C | 47K |
| 280. | UT69151CDXEWCC | Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. +5V operation. Lead finish gold. | UTMC | FlatPack | 100 | -55°C | 125°C | 47K |
| 281. | UT69151CDXEWCX | Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. +5V operation. Lead finish optional. | UTMC | FlatPack | 100 | -55°C | 125°C | 47K |
