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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 961. | 10TP581T | Thermopile type Infrared sensor | SMTC | TO-18 | 4 | -20°C | 100°C | 796K |
| 962. | ITM1010TR
| CDMA Cellular/CDMA450 Receiver RF Front-end IC | INTERGRANT | - | | - | - | 629K |
| 963. | UT22VP10T-15PPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 964. | UT22VP10T-15PPC | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 965. | UT22VP10T-15PPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 966. | UT22VP10T-15PPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 967. | UT22VP10T-15UPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 968. | UT22VP10T-15UPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 969. | UT22VP10T-15UPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
| 970. | UT22VP10T-15UPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
| 971. | UT22VP10T-15WPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 972. | UT22VP10T-15WPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 973. | UT22VP10T-15WPC | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 974. | UT22VP10T-15WPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 975. | UT22VP10T-15WPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 976. | UT22VP10T-20PPA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 977. | UT22VP10T-20PPC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 978. | UT22VP10T-20PPX | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
