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Found: 978      Displaying: 941 - 960
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
941.
UT22VP10T-20UPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
942.
UT22VP10T-20UPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.
UTMC
FlatPack
24
-
-
287K
943.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
944.
UT22VP10T-20WPARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
945.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
946.
UT22VP10T-20WPCRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
947.
UT22VP10T-20WPXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
948.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
949.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
950.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
951.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
952.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
953.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
954.
UT22VP10T-25PPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
955.
UT22VP10T-25UPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
FlatPack
24
-
-
287K
956.
UT22VP10T-25UPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
957.
UT22VP10T-25WPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
958.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
959.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
960.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
961.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
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