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GetDatasheet is a free electronic engineering tool that enables you to locate product datasheets from hundreds of electronic component manufacturers worldwide.

Found: 317      Displaying: 301 - 317
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
301.
AM9128-10PC2048 x 8 static RAM, 100ns
AMD
PDIP
24
0°C
70°C
429K
302.
AT93C66-10PC-1.83-wire serial EEPROM, 250KHz, 1.8V to 5.5V
ATMEL
PDIP
8
0°C
70°C
243K
303.
CY7C419–10PC256 x 9 asynchronous FIFO, 10 ns
CYPR
DIP
28
0°C
70°C
508K
304.
CY7C421–10PC512 x 9 asynchronous FIFO, 10 ns
CYPR
DIP
28
0°C
70°C
508K
305.
CY7C425–10PC1K x 9 asynchronous FIFO, 10 ns
CYPR
DIP
28
0°C
70°C
508K
306.
CY7C429–10PC2K x 9 asynchronous FIFO, 10 ns
CYPR
DIP
28
0°C
70°C
508K
307.
CY7C433–10PC4K x 9 asynchronous FIFO, 10 ns
CYPR
DIP
28
0°C
70°C
508K
308.
MS62256L-10PC32K x 8 CMOS static RAM, 100ns
MOSEL
PDIP
28
0°C
70°C
371K
309.
PALC22V10D-10PCFlash erasable, reprogrammable CMOS PAL device, 10ns
CYPR
DIP
24
0°C
75°C
332K
310.
PALCE20V8H-10PC/4EE CMOS universal programmable array logic, 10ns
LATIC
PDIP
24
0°C
70°C
518K
311.
PALCE22V10-10PCFlash erasable, reprogrammable CMOS PAL device, 10ns
CYPR
DIP
24
0°C
75°C
384K
312.
UT54ACS10PCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
313.
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
314.
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
315.
UT54ACS10PCXRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
316.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
317.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
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