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Found: 185      Displaying: 21 - 40
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
21.
5962-9652101VCARadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish solder. Total dose none.
UTMC
Ceramic DIP
14
-55°C
125°C
10M
22.
5962-9652101VCCRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish gold. Total dose none.
UTMC
Ceramic DIP
14
-55°C
125°C
10M
23.
5962-9652101VCXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic DIP
14
-55°C
125°C
10M
24.
5962-9652101VXARadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish solder. Total dose none.
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
25.
5962-9652101VXARadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish solder. Total dose none.
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
26.
5962-9652101VXXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
27.
5962H9652101VCARadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
28.
5962H9653101VCARadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
29.
5962H9653101VCARadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
30.
5962H9653101VCXRadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
31.
5962H9653101VXARadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
32.
5962H9653101VXCRadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
33.
5962H9653101VXCRadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
34.
5962H9653101VXXRadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
35.
5962R9652101VCARadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish solder. Total dose 1E5 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
36.
5962R9652101VCCRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish gold. Total dose 1E5 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
37.
5962R9652101VCXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose 1E5 rads(Si).
UTMC
Ceramic DIP
14
-55°C
125°C
10M
38.
5962R9652101VXCRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish gold. Total dose 1E5 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
39.
5962R9652101VXXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose 1E5 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
40.
5962R9652101VXXRadHard MSI: SMD. Triple 3-input NAND gates. Class V, QML. Lead finish optional. Total dose 1E5 rads(Si).
UTMC
Ceramic flatpack
14
-55°C
125°C
10M
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