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Found: 110      Displaying: 101 - 110
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
101.
UT22VP10C-20WCCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
102.
UT22VP10C-20WCCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
103.
UT22VP10C-20WCXRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
104.
UT22VP10C-20WCXRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
105.
UT22VP10E-20WCARadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
106.
UT22VP10E-20WCARadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
107.
UT22VP10E-20WCCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
108.
UT22VP10E-20WCCRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
109.
UT22VP10E-20WCXRadiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
110.
UT22VP10T-20WCARadiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
111.
UT22VP10T-20WCXRadiation Hardened PAL. TTL I/O: 20ns propagation delay. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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