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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 461. | 5962D9960701QXA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 462. | 5962D9960701TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 463. | 5962D9960701TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 464. | 5962D9960701TXX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 465. | 5962D9960702TUA | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 466. | 5962D9960702TUC | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 467. | 5962D9960702TUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 468. | 5962D9960702TUX | 512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 469. | 5962D9960703TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 470. | 5962D9960703TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 471. | 5962D9960703TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 127K |
| 472. | 5962D9960703TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -55°C | 125°C | 127K |
| 473. | 5962D9960704TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 474. | 5962D9960704TUA | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 475. | 5962D9960704TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 476. | 5962D9960704TUC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 477. | 5962D9960704TUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 478. | 5962D9960704TUX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Ceramic flatpack | 36 | -40°C | 125°C | 127K |
| 479. | 5962D9960704TXC | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
| 480. | 5962D9960704TXX | 512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) | UTMC | Flatpack shielded | 36 | -40°C | 125°C | 127K |
