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Found: 681      Displaying: 601 - 620
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
601.
 5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
602.
 5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
603.
 5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
604.
 5962P0053601QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
605.
 5962P0053601QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
606.
 5962P0053601QXX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
607.
 5962P0053602QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
608.
 5962P0053602QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
609.
 5962P0053602QXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
610.
 5962P0053602QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
611.
 5962P0053603QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
612.
 5962P0053603QUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
613.
 5962P0053603QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
614.
 5962P0053603QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
615.
 5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
616.
 5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
617.
 5962P0053604QUC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
618.
 5962P0053604QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
619.
 5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
620.
 5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
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