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Found: 681      Displaying: 521 - 540
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
521.
 5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
522.
 5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
523.
 5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
524.
 5962D0053601TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
525.
 5962D0053601TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
526.
 5962D0053601TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
527.
 5962D0053602TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
528.
 5962D0053602TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
529.
 5962D0053602TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
530.
 5962D0053602TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
531.
 5962D0053603TUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
532.
 5962D0053603TXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
533.
 5962D0053603TXX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
534.
 5962D0053603TXX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
535.
 5962D0053604TUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
536.
 5962D0053604TUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
537.
 5962D0053604TXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
538.
 5962D0053604TXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
539.
 5962D0053604TXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
540.
 5962D0053604TXX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
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