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Found: 2100      Displaying: 1981 - 2000
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1981.
 5962-9659401VRARadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish solder. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1982.
 5962-9659401VRXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1983.
 5962-9659401VRXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1984.
 5962-9659401VXXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic flatpack
20
-55°C
125°C
10M
1985.
 5962-9659501VRARadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish solder. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1986.
 5962-9659501VRARadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish solder. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1987.
 5962-9659501VRCRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish gold. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1988.
 5962-9659501VRXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1989.
 5962-9659501VRXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic DIP
20
-55°C
125°C
10M
1990.
 5962-9659501VXXRadHard MSI: SMD. Octal driver, w/three-state outputs. Class V, QML. Lead finish optional. Total dose none.
UTMC
Ceramic flatpack
20
-55°C
125°C
10M
1991.
 5962H9475401VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1992.
 5962H9475401VLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
1993.
 5962H9475401VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1994.
 5962H9475401VLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
DIP
24
-55°C
125°C
287K
1995.
 5962H9475401VXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
FlatPack
24
-55°C
125°C
287K
1996.
 5962H9475401VXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
1997.
 5962H9475401VXXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
1998.
 5962H9475401VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
1999.
 5962H9475401VYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
UTMC
Quad flatpack
28
-55°C
125°C
287K
2000.
 5962H9475401VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
2001.
 5962H9475401VYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
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