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Found: 399      Displaying: 361 - 380
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
361.
5962-0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose none
UTMC
CQFP
68
-40°C
125°C
135K
362.
5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
363.
5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
364.
5962D0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
365.
5962D0053601TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
366.
5962D0053601TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
367.
5962D0053601TXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
368.
5962D0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 1E4(10krad(Si)).
UTMC
CQFP
68
-40°C
125°C
135K
369.
5962L9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
370.
5962L9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
371.
5962L9960701TUC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
372.
5962L9960701TUX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
373.
5962L9960701TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
374.
5962L9960701TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
375.
5962P0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 3E4(30krad(Si)).
UTMC
CQFP
68
-40°C
125°C
135K
376.
5962P0151101TXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class T. Total dose 3E4(30krad(Si)).
UTMC
CQFP
68
-40°C
125°C
135K
377.
5962P9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
378.
5962P9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
379.
5962P9960701TUC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
380.
5962P9960701TUX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
381.
5962P9960701TUX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
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