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Found: 399      Displaying: 341 - 360
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
341.
5962-0153201TYX1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish factory option. Total dose none.
UTMC
CFP
44
-40°C
125°C
95K
342.
5962-0153301TXC512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose none
UTMC
CQFP
68
-40°C
125°C
135K
343.
5962-0153301TXC512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose none
UTMC
CQFP
68
-40°C
125°C
135K
344.
5962D0153201TYA1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
CFP
44
-40°C
125°C
95K
345.
5962D0153201TYX1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
UTMC
CFP
44
-40°C
125°C
95K
346.
5962D9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
347.
5962D9960701TUC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
348.
5962D9960701TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
349.
5962D9960701TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
350.
5962D9960701TXX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
351.
5962L0153201TYA1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
CFP
44
-40°C
125°C
95K
352.
5962L0153201TYC1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)).
UTMC
CFP
44
-40°C
125°C
95K
353.
5962L0153201TYX1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish factory option. Total dose 5E4(50krad(Si)).
UTMC
CFP
44
-40°C
125°C
95K
354.
5962L0153301TXC512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)).
UTMC
CQFP
68
-40°C
125°C
135K
355.
5962P0153201TYA1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
CFP
44
-40°C
125°C
95K
356.
5962P0153201TYX1024K8 SRAM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
CFP
44
-40°C
125°C
95K
357.
5962P0153301TXC512K32 16Megabit SRAM MCM: SMD. 25ns access time, 3.3V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
CQFP
68
-40°C
125°C
135K
358.
5962P9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
359.
5962P9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
360.
5962P9960701TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
361.
5962P9960701TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
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