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Found: 1731      Displaying: 1621 - 1640
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1621.
5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
1622.
5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
1623.
5962P0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
1624.
5962P0053601QUC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
1625.
5962P0053601QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
1626.
5962P0053602QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
1627.
5962P0053602QXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
1628.
5962P0053602QXC512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
1629.
5962P0053602TUX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
1630.
5962P0053602TUX512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
1631.
5962P0053603QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
1632.
5962P0053603QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
1633.
5962P0053603QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
1634.
5962P0053603TUX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
1635.
5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
1636.
5962P0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
1637.
5962P0053604QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
1638.
5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
1639.
5962P0053604QXC512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
1640.
5962P0053604TUX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
1641.
5962P0053604TUX512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
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