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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 5321. | APL1086-25FC-TR | 2.5 V, 1.5 A low dropout fast response positive adjustable regulator and fixed | ANPEC | TO-220 | 3 | 0°C | 70°C | 141K |
| 5322. | APL1086-25FC-TU | 2.5 V, 1.5 A low dropout fast response positive adjustable regulator and fixed | ANPEC | TO-220 | 3 | 0°C | 70°C | 141K |
| 5323. | APL1086-25GC-TU | 2.5 V, 1.5 A low dropout fast response positive adjustable regulator and fixed | ANPEC | TO-263 | 3 | 0°C | 70°C | 141K |
| 5324. | UT22VP10C-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 5325. | UT22VP10C-25PPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 5326. | UT22VP10C-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 5327. | UT22VP10C-25UPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 5328. | UT22VP10C-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 5329. | UT22VP10C-25WPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 5330. | UT22VP10E-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 5331. | UT22VP10E-25PPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 5332. | UT22VP10E-25PPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 5333. | UT22VP10E-25PPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 5334. | UT22VP10E-25PPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 5335. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 5336. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 5337. | UT22VP10E-25UPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 5338. | UT22VP10E-25UPX | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
| 5339. | UT22VP10E-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 5340. | UT22VP10E-25WPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
