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Found: 5448      Displaying: 5301 - 5320
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
5301.
UT22VP10E-25WCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
5302.
UT22VP10E-25WCXRadiation Hardened PAL. CMOS I/O: 25ns propagation delay. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
5303.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
5304.
UT22VP10T-25PCARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish solder.
UTMC
DIP
24
-55°C
125°C
287K
5305.
UT22VP10T-25PCCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish gold.
UTMC
DIP
24
-55°C
125°C
287K
5306.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
5307.
UT22VP10T-25PPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
DIP
24
-
-
287K
5308.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
5309.
UT22VP10T-25PPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
DIP
24
-
-
287K
5310.
UT22VP10T-25PPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
DIP
24
-
-
287K
5311.
UT22VP10T-25UCCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish gold.
UTMC
FlatPack
24
-55°C
125°C
287K
5312.
UT22VP10T-25UCXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish optional.
UTMC
FlatPack
24
-55°C
125°C
287K
5313.
UT22VP10T-25UPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
FlatPack
24
-
-
287K
5314.
UT22VP10T-25UPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
FlatPack
24
-
-
287K
5315.
UT22VP10T-25WCCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish gold.
UTMC
Quad flatpack
28
-55°C
125°C
287K
5316.
UT22VP10T-25WCXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Lead finish optional.
UTMC
Quad flatpack
28
-55°C
125°C
287K
5317.
UT22VP10T-25WPARadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish solder.
UTMC
Quad flatpack
28
-
-
287K
5318.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
5319.
UT22VP10T-25WPCRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish gold.
UTMC
Quad flatpack
28
-
-
287K
5320.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
5321.
UT22VP10T-25WPXRadiation Hardened PAL. TTL I/O: 25ns propagation delay. Prototype flow. Lead finish optional.
UTMC
Quad flatpack
28
-
-
287K
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