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W4N datasheet



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Found: 16      Displaying: 1 - 16
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
SSW4N60B600V N-Channel MOSFET
FAIR
-
-
-
-
642K
2.
W4NRD0X-0000Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
3.
W4NRD8C-U000Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
4.
W4NRE0X-0D00Diameter: 76.2mm; standard micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
5.
W4NXD8C-0000Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
6.
W4NXD8C-L000Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
7.
W4NXD8C-S000Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
8.
W4NXD8D-0000Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
9.
W4NXD8D-S000Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
10.
W4NXD8G-0000Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
11.
W4NXE4C-0D00Diameter: 76.2mm; standard micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
12.
W4NXE4C-LD00Diameter: 76.2mm; low micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
13.
W4NXE4C-SD00Diameter: 76.2mm; select micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
14.
W4NXE8C-0D00Diameter: 76.2mm; standard micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
15.
W4NXE8C-LD00Diameter: 76.2mm; low micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
16.
W4NXE8C-SD00Diameter: 76.2mm; select micropipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
CREE
-
-
-
-
279K
1


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