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9607 datasheet



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Found: 155      Displaying: 1 - 20
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
1.
5962D9960701TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
2.
5962D9960701TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
3.
5962D9960701TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
4.
5962D9960701TXX512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
5.
5962D9960702TUA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
6.
5962D9960702TXA512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
7.
5962D9960702TXC512K x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
8.
5962D9960703TUA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
9.
5962D9960703TUA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
10.
5962D9960703TXA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
11.
5962D9960703TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-55°C
125°C
127K
12.
5962D9960704TUA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
13.
5962D9960704TUA512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
14.
5962D9960704TXC512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
15.
5962D9960704TXX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si)
UTMC
Flatpack shielded
36
-40°C
125°C
127K
16.
SA9607MPASingle phase power/enrgy metering IC with tamper detection
SAMES
DIP
20
-25°C
85°C
98K
17.
SA9607MSASingle phase power/enrgy metering IC with tamper detection
SAMES
SOIC
20
-25°C
85°C
98K
18.
SA9607PPAProgrammable single phase energy metering IC with tamper detection
SAMES
DIP
20
-25°C
85°C
127K
19.
SA9607PSAProgrammable single phase energy metering IC with tamper detection
SAMES
SOIC
20
-25°C
85°C
127K
20.
UM9607PIN Diode
MSEMI
SEE_FACTORY
-
-
-
457K
1 2 3 4 5 6 7 8


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