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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1. | 5962H9475408QLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 2. | 5962H9475408QLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 3. | 5962H9475408QXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 4. | 5962H9475408QXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 5. | 5962H9475408QXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6. | 5962H9475408QXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 7. | 5962H9475408QYA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 8. | 5962H9475408QYC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 9. | 5962H9475408QYX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 10. | 5962H9475408VLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 11. | 5962H9475408VLC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 12. | 5962H9475408VLC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 13. | 5962H9475408VLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 14. | 5962H9475408VXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 15. | 5962H9475408VXA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 16. | 5962H9475408VXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 17. | 5962H9475408VXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 18. | 5962H9475408VXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 19. | 5962H9475408VYC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 20. | 5962H9475408VYX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
