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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1. | 100323CW | Low Power Hex Bus Driver | FAIR | - | - | - | - | 67K |
| 2. | 100323DMQB | Low Power Hex Bus Driver | NSC | Cerdip | 24 | - | - | 110K |
| 3. | 100323FMQB | Low Power Hex Bus Driver | NSC | Cerquad | 24 | - | - | 110K |
| 4. | 100323PC | Low Power Hex Bus Driver | FAIR | MDIP | 24 | - | - | 67K |
| 5. | 100323QC | Low Power Hex Bus Driver | FAIR | PLCC | 28 | - | - | 67K |
| 6. | 100323QCX | Low Power Hex Bus Driver | FAIR | PLCC | 28 | - | - | 67K |
| 7. | 5962-0323601QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 68 | -55°C | 125°C | 180K |
| 8. | 5962-0323601QXC | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold. | UTMC | Ceramic flatpack | 68 | -55°C | 125°C | 180K |
| 9. | 5962-0323601QXC | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold. | UTMC | Ceramic flatpack | 68 | -55°C | 125°C | 180K |
| 10. | 5962-0323601QXX | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish factory option. | UTMC | Ceramic flatpack | 68 | -55°C | 125°C | 180K |
| 11. | 5962-0323601VXA | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 68 | -55°C | 125°C | 180K |
| 12. | 5962-0323601VXC | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish gold. | UTMC | Ceramic flatpack | 68 | -55°C | 125°C | 180K |
| 13. | 5962-0323602QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 68 | -40°C | 125°C | 180K |
| 14. | 5962-0323602QXA | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 68 | -40°C | 125°C | 180K |
| 15. | 5962-0323602QXC | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish gold. | UTMC | Ceramic flatpack | 68 | -40°C | 125°C | 180K |
| 16. | 5962-0323602QXX | 128K x 32 SRAM: SMD. 15ns access time. Class Q. Lead finish factory option. | UTMC | Ceramic flatpack | 68 | -40°C | 125°C | 180K |
| 17. | 5962-0323602VXA | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish hot solder dipped. | UTMC | Ceramic flatpack | 68 | -40°C | 125°C | 180K |
| 18. | 5962-0323602VXC | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish gold. | UTMC | Ceramic flatpack | 68 | -40°C | 125°C | 180K |
| 19. | 5962-0323602VXX | 128K x 32 SRAM: SMD. 15ns access time. Class V. Lead finish factory option. | UTMC | Ceramic flatpack | 68 | -40°C | 125°C | 180K |
| 20. | 5962R-0323501QUA | 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish hot solder dipped. Total dose 100K rad(Si). | UTMC | Ceramic flatpack | 36 | -55°C | 125°C | 109K |
