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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 101. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 102. | UT22VP10E-25UPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 103. | UT22VP10E-25UPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 104. | UT22VP10E-25WPA | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 105. | UT22VP10E-25WPC | Radiation Hardened PAL. CMOS I/O: 25ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 106. | UT22VP10T-15PPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 107. | UT22VP10T-15PPC | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 108. | UT22VP10T-15PPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 109. | UT22VP10T-15PPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | DIP | 24 | - | - | 287K |
| 110. | UT22VP10T-15UPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 111. | UT22VP10T-15UPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 112. | UT22VP10T-15UPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
| 113. | UT22VP10T-15UPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | FlatPack | 24 | - | - | 287K |
| 114. | UT22VP10T-15WPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 115. | UT22VP10T-15WPA | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 116. | UT22VP10T-15WPC | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 117. | UT22VP10T-15WPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 118. | UT22VP10T-15WPX | Radiation Hardened PAL. TTL I/O: 15.5ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 119. | UT22VP10T-20PPA | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 120. | UT22VP10T-20PPC | Radiation Hardened PAL. TTL I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
