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Found: 30      Displaying: 21 - 30
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
21.
5962-9960601QUA512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose none.
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
22.
5962-9960601QUC512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose none.
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
23.
5962-9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory optional. Total dose none.
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
24.
5962-9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory optional. Total dose none.
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
25.
5962D9960601QUA512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
26.
5962D9960601QUC512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
27.
5962D9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
28.
5962P9960601QUA512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
29.
5962P9960601QUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
30.
5962P9960601TUX512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)).
UTMC
Ceramic flatpack
32
-55°C
125°C
107K
1 2


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