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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1. | UT22VP10C-20PCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | DIP | 24 | -55°C | 125°C | 287K |
| 2. | UT22VP10C-20PPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 3. | UT22VP10C-20PPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | DIP | 24 | - | - | 287K |
| 4. | UT22VP10C-20PPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | DIP | 24 | - | - | 287K |
| 5. | UT22VP10C-20UCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 6. | UT22VP10C-20UCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | FlatPack | 24 | -55°C | 125°C | 287K |
| 7. | UT22VP10C-20UPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | FlatPack | 24 | - | - | 287K |
| 8. | UT22VP10C-20UPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | FlatPack | 24 | - | - | 287K |
| 9. | UT22VP10C-20WCA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish solder. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 10. | UT22VP10C-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 11. | UT22VP10C-20WCC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish gold. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 12. | UT22VP10C-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 13. | UT22VP10C-20WCX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Lead finish optional. | UTMC | Quad flatpack | 28 | -55°C | 125°C | 287K |
| 14. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 15. | UT22VP10C-20WPA | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish solder. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 16. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 17. | UT22VP10C-20WPC | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish gold. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 18. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
| 19. | UT22VP10C-20WPX | Radiation Hardened PAL. CMOS I/O: 20ns propagation delay. Prototype flow. Lead finish optional. | UTMC | Quad flatpack | 28 | - | - | 287K |
