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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1. | 5962-9960601QUA | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose none. | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 2. | 5962-9960601QUC | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose none. | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 3. | 5962-9960601QUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory optional. Total dose none. | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 4. | 5962-9960601QUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory optional. Total dose none. | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 5. | 5962-9960601TUA | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose none. | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 6. | 5962-9960601TUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose none. | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 7. | 5962-9960601TUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose none. | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 8. | 5962D9960601QUA | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 9. | 5962D9960601QUC | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 10. | 5962D9960601QUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 11. | 5962D9960601TUA | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 12. | 5962D9960601TUC | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 13. | 5962D9960601TUC | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 14. | 5962D9960601TUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 15. | 5962P9960601QUA | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 16. | 5962P9960601QUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 17. | 5962P9960601TUC | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 3E4(30krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 18. | 5962P9960601TUC | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 3E4(30krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
| 19. | 5962P9960601TUX | 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)). | UTMC | Ceramic flatpack | 32 | -55°C | 125°C | 107K |
