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| # | Part: | Description: | Manuf. | Package | Pins | T°min | T°max | PDF size |
| 1. | 5962-9658401QEA | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish solder. Total dose none. | UTMC | Ceramic DIP | 16 | -55°C | 125°C | 10M |
| 2. | 5962-9658401QEC | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish gold. Total dose none. | UTMC | Ceramic DIP | 16 | -55°C | 125°C | 10M |
| 3. | 5962-9658401QEX | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish optional. Total dose none. | UTMC | Ceramic DIP | 16 | -55°C | 125°C | 10M |
| 4. | 5962-9658401QEX | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish optional. Total dose none. | UTMC | Ceramic DIP | 16 | -55°C | 125°C | 10M |
| 5. | 5962-9658401QXA | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish solder. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 6. | 5962-9658401QXA | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish solder. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 7. | 5962-9658401QXX | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish optional. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 8. | 5962-9658401QXX | RadHard MSI: SMD. 4-bit binary full adder. Class Q, QML. Lead finish optional. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 9. | 5962-9658401VEA | RadHard MSI: SMD. 4-bit binary full adder. Class V, QML. Lead finish solder. Total dose none. | UTMC | Ceramic DIP | 16 | -55°C | 125°C | 10M |
| 10. | 5962-9658401VEC | RadHard MSI: SMD. 4-bit binary full adder. Class V, QML. Lead finish gold. Total dose none. | UTMC | Ceramic DIP | 16 | -55°C | 125°C | 10M |
| 11. | 5962-9658401VEX | RadHard MSI: SMD. 4-bit binary full adder. Class V, QML. Lead finish optional. Total dose none. | UTMC | Ceramic DIP | 16 | -55°C | 125°C | 10M |
| 12. | 5962-9658401VXA | RadHard MSI: SMD. 4-bit binary full adder. Class V, QML. Lead finish solder. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 13. | 5962-9658401VXC | RadHard MSI: SMD. 4-bit binary full adder. Class V, QML. Lead finish gold. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 14. | 5962-9658401VXX | RadHard MSI: SMD. 4-bit binary full adder. Class V, QML. Lead finish optional. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 15. | 5962-9658401VXX | RadHard MSI: SMD. 4-bit binary full adder. Class V, QML. Lead finish optional. Total dose none. | UTMC | Ceramic flatpack | 16 | -55°C | 125°C | 10M |
| 16. | 5962-9758401Q2A | Dual 4-Input NAND Gate | NSC | LCC | 20 | - | - | 140K |
| 17. | 5962-9758401QCA | Dual 4-Input NAND Gate | NSC | Cerdip | 14 | - | - | 140K |
| 18. | 5962-9758401QDA | Dual 4-Input NAND Gate | NSC | Cerpack | 14 | - | - | 140K |
| 19. | 5962-9958401Q2A | DUAL PULSE-WIDTH-MODULATION CONTROL CIRCUIT | TI | FK | 20 | -55°C | 125°C | 425K |
| 20. | 5962-9958401QEA | DUAL PULSE-WIDTH-MODULATION CONTROL CIRCUIT | TI | J | 16 | -55°C | 125°C | 425K |
