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Found: 762      Displaying: 281 - 300
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
281.
UT54ACS08UCARadHard MSI. Quadruple 2-input AND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
282.
UT54ACS10PCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
283.
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
284.
UT54ACS10PCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
285.
UT54ACS10PCXRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
286.
UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
287.
UT54ACS10UCARadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
288.
UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
289.
UT54ACS10UCCRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
290.
UT54ACS10UCXRadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
291.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
292.
UT54ACTS10PCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
293.
UT54ACTS10UCARadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
294.
UT54ACTS10UCCRadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
295.
UT54ACTS10UCCRadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
296.
UT54ACTS10UCXRadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
297.
UT54ACTS11PCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
298.
UT54ACTS11PCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic DIP
14
-55°C
125°C
15K
299.
UT54ACTS11UCARadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
300.
UT54ACTS11UCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
301.
UT54ACTS11UCXRadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional.
UTMC
Ceramic flatpack
14
-55°C
125°C
15K
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