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Found: 118      Displaying: 61 - 80
#
Part:
Description:
Manuf.
Package
Pins
T°min
T°max
PDF size
61.
 5962L0053601QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
62.
 5962L0053601QXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
63.
 5962L0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
64.
 5962L0053601TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
65.
 5962L0053602QUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
66.
 5962L0053602QXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
67.
 5962L0053602TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
68.
 5962L0053602TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
69.
 5962L0053603QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
70.
 5962L0053603QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-55°C
125°C
128K
71.
 5962L0053603QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
72.
 5962L0053603TXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Flatpack shielded
36
-55°C
125°C
128K
73.
 5962L0053604QUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
74.
 5962L0053604QXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Flatpack shielded
36
-40°C
125°C
128K
75.
 5962L0053604TUA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
UTMC
Ceramic flatpack
36
-40°C
125°C
128K
76.
 5962L0151101QXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 5E4(50krad(Si)).
UTMC
CQFP
68
-40°C
125°C
135K
77.
 5962L9960703QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
78.
 5962L9960703QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-55°C
125°C
127K
79.
 5962L9960704QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
80.
 5962L9960704QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)
UTMC
Ceramic flatpack
36
-40°C
125°C
127K
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